Production todayFinal capability is confirmed after technical review, material availability and qualification requirements. All listed processes are performed internally.
Production capabilities
| Area | Parameter | Current capability |
|---|---|---|
| Materials | Single / double-sided | FR-4 Tg135 / Tg170 |
| Multilayer | FR-4 Tg170 | |
| Minimum finished thickness | 0.36 mm | |
| Minimum inner layer / prepreg | 0.10 mm / 0.063 mm | |
| Maximum finished thickness | 2.40 mm | |
| Maximum layer count | 24 | |
| Aluminium PCB | Available and manufactured | |
| Holes & conductors | Minimum drilled hole / blind via | 0.10 mm / 0.10 mm |
| Drill tolerance | ±0.10 mm | |
| Maximum plugged hole under solder mask | 0.40 mm | |
| Minimum annular ring, inner / outer | 0.10 mm / 0.05 mm | |
| Blind-via aspect ratio | 1:1 | |
| Minimum drill-to-drill distance | 0.15 mm | |
| Minimum inner-layer line / gap | 0.075 / 0.075 mm | |
| Minimum outer-layer line / gap | 0.060 / 0.060 mm | |
| Sequential build-up | Up to 3 cycles | |
| Blind / buried vias and back drilling | Available | |
| Copper & finish | Starting copper, outer | 12 / 18 / 35 / 70 µm |
| Starting copper, inner | 18 / 35 / 70 µm | |
| Finished outer copper | 47 / 70 / 105 µm | |
| Maximum copper | 105 µm, inner and outer | |
| Surface finishes | Lead-free HASL; ENIG | |
| Mechanical | Routing tool / tolerance | 0.20–2.50 mm / ±0.10 mm |
| V-cut | 30°; minimum core 0.20 mm | |
| Minimum material for V-cut | 0.80 mm | |
| Board size | 10 × 10 mm to 360 × 460 mm | |
| Blind slots / Z-milling | Available | |
| Solder mask & legend | Solder-mask colours | Green, black, white, blue, red |
| Solder-mask thickness | 20–25 µm | |
| Legend colours | White and black | |
| Legend alignment | ±25 µm |
Express production
24 / 48 / 72-hour manufacturing
Times refer to manufacturing completion, not dispatch. Weekends are excluded. Subject to technical review and production availability.
| Service | Maximum layers | Maximum order area | Key conditions |
|---|---|---|---|
| 24 hours | 10 | 16 dm² | Minimum hole 0.20 mm; up to 10,000 holes; green solder mask; no blind/buried vias |
| 48 hours | 16 | 33 dm² | Minimum hole 0.20 mm; up to 25,000 holes; green solder mask; no blind/buried vias |
| 72 hours | 24 | 33 dm² | Minimum hole 0.20 mm; up to 35,000 holes; no blind/buried vias or half-cut holes |
Programme fit
Prototype and small-series production
Prototype panels
All current PCB technologies available. Normal lead time: 5 working days; blind/buried-via designs: 7 working days.
Small-series panels
Repeatable small-series production with engineering review and documented process control.
Core technologies
Half-cut holes and slots; countersunk holes; bevelled edges; blind and buried vias; Z-milling; back drilling; surface finishes.
Start a project
Send us your PCB package.
Gerber RS-274X data, NC drill files, quantity and required delivery date.